Methods and packages for enhancing reliability of ultraviolet light-emitting devices
US11942569B2 · kind B2 · utility
0Cited by
8References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2018 |
| Grant date | Mar 26, 2024 |
| Priority date | — |
| Expiry date | Jan 31, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/854
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In various embodiments, degradation of epoxy within packages for ultraviolet light-emitting devices is reduced or substantially eliminated via package venting, prevention of transmission of ultraviolet light to one or more regions of epoxy utilized in the package, and/or utilization of packaging schemes that reduce or avoid utilization of epoxy and/or specific metals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.