Circuit board structure and manufacturing method thereof
US11943877B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2022 |
| Grant date | Mar 26, 2024 |
| Priority date | — |
| Expiry date | Mar 2, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0195
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board structure includes a circuit substrate having opposing first and second sides, a redistribution structure disposed at the first side, and a dielectric structure disposed at the second side. The circuit substrate includes a first circuit layer disposed at the first side and a second circuit layer disposed at the second side. The redistribution structure is electrically coupled to the circuit substrate and includes a first leveling dielectric layer covering the first circuit layer, a first thin-film dielectric layer disposed on the first leveling dielectric layer and having a material different from the first leveling dielectric layer, and a first redistributive layer disposed on the first thin-film dielectric layer and penetrating through the first thin-film dielectric layer and the first leveling dielectric layer to be in contact with the first circuit layer. The dielectric structure includes a second leveling dielectric layer disposed below the second circuit layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.