Method for controlling a manufacturing process and associated apparatuses
US11947266B2 · kind B2 · utility
3Cited by
2References
20Claims
0Family size
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Key dates
| Filing date | Nov 14, 2019 |
| Grant date | Apr 2, 2024 |
| Priority date | — |
| Expiry date | Mar 10, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/7046
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for determining a correction relating to a performance metric of a semiconductor manufacturing process, the method including: obtaining a set of pre-process metrology data; processing the set of pre-process metrology data by decomposing the pre-process metrology data into one or more components which: a) correlate to the performance metric; or b) are at least partially correctable by a control process which is part of the semiconductor manufacturing process; and applying a trained model to the processed set of pre-process metrology data to determine the correction for the semiconductor manufacturing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.