Patent · US Active

Liquid sputter target

US11952654B2 · kind B2 · utility

0Cited by

2References

29Claims

0Family size

Assignee

EVATEC AG · CH

Inventors

Dominik Jaeger · Steinbach-Hallenberg, DE
Thomas Tschirky · Mels, CH
Marco Rechsteiner · Leversschwendi, CH
Heinz Felzer · Landquart, CH
Hartmut Rohrmann · Schriesheim, DE

Key dates

Filing date	Oct 22, 2019
Grant date	Apr 9, 2024
Priority date	—
Expiry date	Mar 12, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01J2237/332
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A sputtering device to sputter a liquid target. The sputtering device including a trough to receive a liquid target material and a device to stir or agitate the liquid target material. The device configured to degas the liquid target material or/and to dissipate solid particles or islands on a surface of the target or/and to move such particles or islands from an active surface region to a passive surface region and/or vice-versa, whereby the passive surface region is at least 50% less exposed to sputtering as the active surface region.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.