Method and apparatus for cleaning semiconductor wafer
US11955328B2 · kind B2 · utility
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10References
17Claims
0Family size
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Key dates
| Filing date | Apr 20, 2022 |
| Grant date | Apr 9, 2024 |
| Priority date | — |
| Expiry date | Apr 20, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/673
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for cleaning semiconductor wafer includes putting at least one wafer on a cassette bracket in a first cleaning tank filled with chemical solution; after said wafers have been processed in the first cleaning tank, transferring the wafers from the first cleaning tank to a second cleaning tank with the wafers immersing in the chemical solution; and after said wafers have been processed in the second cleaning tank, taking the wafers out of the second cleaning tank.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.