Electrostatic chuck and processing apparatus
US11955360B2 · kind B2 · utility
0Cited by
3References
8Claims
0Family size
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Key dates
| Filing date | Dec 24, 2020 |
| Grant date | Apr 9, 2024 |
| Priority date | — |
| Expiry date | Jul 28, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68757
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A Johnsen-Rahbek force type electrostatic chuck including: a metal substrate; an electrode for electrostatic attraction provided on the metal substrate with an insulating layer interposed between the metal substrate and the electrode for electrostatic attraction; and a dielectric layer constituting an electrostatic attraction surface in contact with a workpiece. The dielectric layer includes a ceramic spray coating and a sealing component with which pores of the ceramic spray coating are filled, and the sealing component contains a metal organic salt containing a rare earth element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.