Patent · US Active

Fan out package with integrated peripheral devices and methods

US11955395B2 · kind B2 · utility

0Cited by

2References

18Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Lizabeth Keser · Chandler, US
Bernd Waidhas · Nittendorf, DE
Thomas Ort · Veitsbronn, DE
Thomas Wagner · Regelsbach, DE

Key dates

Filing date	Jun 30, 2022
Grant date	Apr 9, 2024
Priority date	—
Expiry date	Jun 30, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH10D1/68
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device and method of including peripheral devices into a package is disclosed. In one example, a peripheral device includes a passive device such as a capacitor or an inductor. Examples are shown that include a peripheral device that is substantially the same thickness as a die or a die assembly. Examples are further shown that use this configuration in a fan out process to form semiconductor devices.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.