Patent · US Active

Electronic module including a semiconductor package connected to a fluid heatsink

US11955407B2 · kind B2 · utility

0Cited by

1References

19Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Edward Fuergut · Nuremberg, DE
Davide Chiola · Chino, US
Martin Gruber · Schwandorf, DE
Wolfram Hable · Dresden, DE

Key dates

Filing date	Jan 18, 2021
Grant date	Apr 9, 2024
Priority date	—
Expiry date	Oct 4, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2225/1094
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic module includes a semiconductor package including a die carrier, a semiconductor transistor die disposed on the die carrier, an electrical conductor connected to the semiconductor die, and an encapsulant covering the die carrier, the semiconductor die, and the electrical conductor so that a portion of the electrical conductor extends to the outside of the encapsulant. The electronic module further includes an interposer layer on which the semiconductor package is disposed, and a heat sink through which a cooling medium can flow. The interposer layer is disposed on the heatsink.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.