Skew matching in a die-to-die interface

US11960435B2 · kind B2 · utility

Assignee

• Advanced Micro Devices, Inc. · US

Inventors

• Pradeep Jayaraman · Toronto, CA
• Dean E. Gonzales · Santa Clara, US
• Gerald R. Talbot · Boxborough, US
• Ramon Mangaser · Boxborough, US
• Michael J. Tresidder · Scarborough, CA
• Prasant Kumar Vallur · Hyderabad, IN
• Srikanth Reddy Gruddanti · Kanchinakote, IN
• Krishna Reddy Mudimela Venkata · Bengaluru, IN
• David Hugh McIntyre · Boise, US

Key dates

• Filing date: Mar 10, 2022
• Grant date: Apr 16, 2024
• Expiry date: Mar 10, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2223/6655
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor package for skew matching in a die-to-die interface, including: a first die; a second die aligned with the first die such that each connection point of a first plurality of connection points of the first die is substantially equidistant to a corresponding connection point of a second plurality of connection points of the second die; and a plurality of connection paths of a substantially same length, wherein each connection path of the plurality of connection paths couples a respective connection point of the first plurality of connection points to the corresponding connection point of the second plurality of connection points.