Method of manufacturing a light-emitting device
US11961939B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2022 |
| Grant date | Apr 16, 2024 |
| Priority date | — |
| Expiry date | Jun 23, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/824
Abstract
A method of manufacturing a light-emitting device, including: providing a substrate structure including a top surface; forming a precursor layer on the top surface; removing a portion of the precursor layer and a portion of the substrate from the top surface to form a base portion and a plurality of protrusions regularly arranged on the base portion; forming a buffer layer on the base portion and the plurality protrusions; and forming a III-V compound cap layer on the buffer layer; wherein one of the plurality of protrusions comprises a first portion and a second portion formed on the first portion; wherein the first portion is integrated with the base portion and has a first material which is the same as that of the base portion; and wherein the buffer layer contacts side surfaces of the plurality of protrusions and a surface of the base portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.