High temperature electronic device thermal management system
US11963341B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2021 |
| Grant date | Apr 16, 2024 |
| Priority date | — |
| Expiry date | Sep 15, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20818
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A high temperature electronic device thermal management system. Data centers contain many large racks of computer servers with electronic devices that generate heat. For the devices to function properly, they must not exceed a maximum temperature. Typical techniques for thermal management of data center electronics involve using sub-ambient temperature coolants via refrigeration cycles, requiring significant input energy to operate. The present thermal management system includes a flow management system to produce elevated coolant temperatures while sustaining safe device temperatures. This allows the coolant to reject to ambient temperatures globally and year-round, enabling reduced energy usage by no longer requiring refrigeration cycles. Further, operation at or above 55° C. would allow for implementation of additional waste heat recovery processes with increased energy efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.