Polishing pad comprising window similar in hardness to polishing layer
US11964360B2 · kind B2 · utility
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7Claims
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Key dates
| Filing date | Jul 10, 2018 |
| Grant date | Apr 23, 2024 |
| Priority date | — |
| Expiry date | Aug 21, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/306
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Embodiments relate to a polishing pad, which comprises a window having a hardness similar to that of its polishing layer. Since the polishing pad comprises a window having a hardness and a polishing rate similar to those of its polishing layer, it can produce an effect of preventing scratches on a wafer during a CMP process. In addition, the polishing layer and the window of the polishing pad have a similar rate of change in hardness with respect to temperature, so that they can maintain a similar hardness despite a change in temperature during the CMP process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.