Control of processing parameters during substrate polishing using expected future parameter changes
US11969854B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2022 |
| Grant date | Apr 30, 2024 |
| Priority date | — |
| Expiry date | Apr 7, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/013
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Controlling a polishing system includes receiving from an in-situ monitoring system, for each region of a plurality of regions on a substrate being processed by the polishing system, a sequence of characterizing values for the region. For each region, a polishing rate is determined for the region, and an adjustment is calculated for at least one processing parameter. For each of a plurality of parameter update times, an adjustment is calculated for at least one processing parameter, wherein calculation of the adjustment for a particular parameter update time from the plurality of parameter update times includes calculation of expected future parameter changes for one or more future parameter update times subsequent to the particular parameter update time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.