Inventor · San Jose, CA, US

Benjamin Cherian

44Patents
6h-index
37Co-inventors
65Inventor score

Filing activity: Oct 23, 2012 → Sep 21, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US10478937B2 Acoustic emission monitoring and endpoint for chemical mechanical polishing Performing Operations; Transporting 13 Active
US9490186B2 Limiting adjustment of polishing rates during substrate polishing Electricity 11 Active
US10795346B2 Machine learning systems for monitoring of semiconductor processing Emerging Cross-Sectional Technologies 9 Active
US10994389B2 Polishing apparatus using neural network for monitoring Electricity 8 Active
US9227293B2 Multi-platen multi-head polishing architecture Performing Operations; Transporting 7 Active
US9551567B2 Reducing noise in spectral data from polishing substrates Electricity 6 Active
US8992286B2 Weighted regression of thickness maps from spectral data Performing Operations; Transporting 4 Active
US9242337B2 Dynamic residue clearing control with in-situ profile control (ISPC) Performing Operations; Transporting 4 Active
US10969773B2 Machine learning systems for monitoring of semiconductor processing Emerging Cross-Sectional Technologies 3 Active
US9833874B2 Applying dimensional reduction to spectral data from polishing substrates Electricity 3 Active
US9375824B2 Adjustment of polishing rates during substrate polishing with predictive filters Physics 3 Active
US9056383B2 Path for probe of spectrographic metrology system Performing Operations; Transporting 2 Active
US11780047B2 Determination of substrate layer thickness with polishing pad wear compensation Physics 2 Active
US10086492B2 Applying dimensional reduction to spectral data from polishing substrates Electricity 2 Active
US11507824B2 Training spectrum generation for machine learning system for spectrographic monitoring Physics 2 Active
US11577356B2 Machine vision as input to a CMP process control algorithm Physics 2 Active
US11658078B2 Using a trained neural network for use in in-situ monitoring during polishing and polishing system Physics 1 Active
US11931853B2 Control of processing parameters for substrate polishing with angularly distributed zones using cost function Electricity 1 Active
US11969854B2 Control of processing parameters during substrate polishing using expected future parameter changes Performing Operations; Transporting 1 Active
US10732607B2 Spectrographic monitoring using a neural network Physics 1 Active
US11919121B2 Control of processing parameters during substrate polishing using constrained cost function Performing Operations; Transporting 1 Active
US11710228B2 Detecting an excursion of a CMP component using time-based sequence of images and machine learning Electricity 1 Active
US12311494B2 Pressure signals during motor torque monitoring to provide spatial resolution Performing Operations; Transporting 0 Active
US12343840B2 Control of processing parameters for substrate polishing with substrate precession Electricity 0 Active
US12257665B2 Machine vision as input to a CMP process control algorithm Physics 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.