Wafer processing system and rework method thereof
US11971365B2 · kind B2 · utility
0Cited by
6References
12Claims
0Family size
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Key dates
| Filing date | Jan 6, 2022 |
| Grant date | Apr 30, 2024 |
| Priority date | — |
| Expiry date | May 22, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/8325
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A wafer processing system and a rework method thereof are provided. An image capture device captures an image of a wafer to generate a captured image. A control device detects a defect pattern in the captured image, calculates a target removal thickness according to distribution of contrast values of the defect pattern, and controls a processing device to perform processing on the wafer according to the target removal thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.