Methods and apparatus for measuring a property of a substrate
US11977034B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2021 |
| Grant date | May 7, 2024 |
| Priority date | — |
| Expiry date | Sep 12, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked to at least partially recompose the measurement results according to the sample plan.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.