Thermal chamber with improved thermal uniformity

US11978646B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Dongming Iu · Union City, US
• Kartik Shah · Saratoga, US
• Norman L. Tam · Cupertino, US
• Matthew Spuller · Belmont, US
• Jau-Jiun CHEN · San Jose, US
• Kong CHAN · Tsuen Wan, CN
• Elizabeth Neville · Palo Alto, US
• Preetham Rao · Bengaluru, IN
• Abhilash J. Mayur · Salinas, US
• Gia Khanh Pham · Charlotte, US

Key dates

• Filing date: May 17, 2018
• Grant date: May 7, 2024
• Expiry date: Sep 24, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67098
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments of the disclosure generally relate to a semiconductor processing chamber. In one embodiment, semiconductor processing chamber is disclosed and includes a chamber body having a bottom and a sidewall defining an interior volume, the sidewall having a substrate transfer port formed therein, and one or more absorber bodies positioned in the interior volume in a position opposite of the substrate transfer port.