Wiring structure and electronic device employing the same
US11978704B2 · kind B2 · utility
0Cited by
5References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2020 |
| Grant date | May 7, 2024 |
| Priority date | — |
| Expiry date | Jul 20, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Example embodiments relate to a wiring structure, a method of forming the same, and an electronic device employing the same. The wiring structure includes a first conductive material layer and a nanocrystalline graphene layer on the first conductive material layer in direct contact with the metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.