Polishing device, polishing method, and recording medium for recording program for determining supply position of polishing liquid
US11980998B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2020 |
| Grant date | May 14, 2024 |
| Priority date | — |
| Expiry date | Jan 27, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D13/20
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An operation control unit includes a storage device storing a program which includes commands of: obtaining a correlation between a supply position of the polishing liquid in the radial direction of the polishing pad using the liquid injection nozzle and an average polishing rate of the substrate and an distribution of the polishing rate within the substrate; determining a movable range of the liquid injection nozzle according to a predetermined range of an allowable average polishing rate and the correlation between the supply position of the polishing liquid and the average polishing rate; determining an optimal supply position of the polishing liquid from the correlation between the supply position of the polishing liquid and the distribution of the polishing rate within the substrate within the determined movable range of the liquid injection nozzle; and moving the liquid injection nozzle to the determined supply position to polish the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.