Electronic package, manufacturing method for the same, and electronic structure
US11984393B2 · kind B2 · utility
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1References
6Claims
0Family size
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Key dates
| Filing date | Nov 23, 2020 |
| Grant date | May 14, 2024 |
| Priority date | — |
| Expiry date | Dec 7, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package is provided, in which an electronic structure used as an integrated voltage regulator and a plurality of conductive pillars are embedded in an encapsulating layer to facilitate electrical transmission with electronic components at a close range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.