Packaging structure with antenna and manufacturing method thereof
US11984414B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2022 |
| Grant date | May 14, 2024 |
| Priority date | — |
| Expiry date | Sep 24, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15321
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaging structure with an antenna and a manufacturing method thereof are disclosed. The packaging structure includes a package, an antenna circuit, an interconnecting circuit, an outer-layer circuit, and a chip. The package is internally packaged with a first conducting through hole column and a second conducting through hole column. The antenna circuit is disposed on a first surface and a sidewall of the package. The interconnecting circuit is packaged in the package, and is connected to the antenna circuit by the first conducting through hole column. The outer-layer circuit is disposed on a second surface of the package, and is connected to the interconnecting circuit by the second conducting through hole column. The outer-layer circuit is further connected to a conductive pin. The chip is packaged in the package, and is connected to the interconnecting circuit or the outer-layer circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.