Slurry distribution device for chemical mechanical polishing
US11986926B2 · kind B2 · utility
0Cited by
33References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2022 |
| Grant date | May 21, 2024 |
| Priority date | — |
| Expiry date | Aug 26, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6708
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a curved barrier positioned after the dispenser to spread fresh polishing liquid from the dispenser.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.