Thermal management planes
US11988453B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2022 |
| Grant date | May 21, 2024 |
| Priority date | — |
| Expiry date | Feb 7, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3736
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.