Selective EMI shielding using preformed mask
US11990424B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2023 |
| Grant date | May 21, 2024 |
| Priority date | — |
| Expiry date | Apr 19, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package has a substrate, a first component disposed over the substrate, an encapsulant deposited over the first component, and a second component disposed over the substrate outside the encapsulant. A metal mask is disposed over the second component. A shielding layer is formed over the semiconductor package. The metal mask after forming the shielding layer. The shielding layer is optionally formed on a contact pad of the substrate while a conic area above the contact pad that extends 40 degrees from vertical remains free of the encapsulant and metal mask while forming the shielding layer. Surfaces of the metal mask and encapsulant oriented toward the contact pad can be sloped. The metal mask can be disposed and removed using a pick-and-place machine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.