Device for bonding chips
US11990463B2 · kind B2 · utility
2Cited by
17References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 8, 2021 |
| Grant date | May 21, 2024 |
| Priority date | — |
| Expiry date | May 1, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/97
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and device for bonding chips onto a substrate or onto further chips. The chips are bonded onto the substrate or the further chips by means of a direct bond using a bond head having a first surface configured to couple to a chip that is to be bonded, and a second surface fixed to and disposed opposite the first surface. A first spring element having a first spring constant and a second spring element having a second spring constant are coupled to the second surface, where the first spring constant is different from the second spring constant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.