Circuit board structure and manufacturing method thereof
US11991824B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2021 |
| Grant date | May 21, 2024 |
| Priority date | — |
| Expiry date | Jul 29, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/201
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board structure includes a first sub-circuit board, a second sub-circuit board, and a third sub-circuit board. The first sub-circuit board has an upper surface and a lower surface opposite to each other, and includes at least one first conductive through hole. The second sub-circuit board is disposed on the upper surface of the first sub-circuit board and includes at least one second conductive through hole. The third sub-circuit board is disposed on the lower surface of the first sub-circuit board and includes at least one third conductive through hole. At least two of the first conductive through hole, the second conductive through hole, and the third conductive through hole are alternately arranged in an axial direction perpendicular to an extending direction of the first sub-circuit board. The first, second and third sub-circuit boards are electrically connected to one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.