Testing device for integrated circuit package
US11994534B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2023 |
| Grant date | May 28, 2024 |
| Priority date | — |
| Expiry date | Mar 13, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/045
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A testing device for testing an integrated circuit package is provided, including a printed circuit board, a testing socket, a conductive fastener, a cover, and a conductive element assembly. The printed circuit board includes a first metal layer formed on the bottom surface thereof. The testing socket is disposed above the printed circuit board. The conductive fastener is configured to secure the testing socket to the printed circuit board, wherein the conductive fastener is electrically connected to the first metal layer and the testing socket. The cover is disposed above the testing socket to form a space for accommodating the integrated circuit package between the cover and the testing socket, wherein the cover makes electrical contact with the integrated circuit package. The conductive element assembly is disposed between and electrically connected to the cover and the testing socket.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.