Chun-Hsing Chen
4Patents
2h-index
8Co-inventors
37Inventor score
Filing activity: Jun 3, 2008 → Mar 13, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7750651B2 | Wafer level test probe card | Emerging Cross-Sectional Technologies | 11 | Active |
| US8146245B2 | Method for assembling a wafer level test probe card | Emerging Cross-Sectional Technologies | 3 | Active |
| US11604211B1 | Testing device and method for integrated circuit package | Physics | 1 | Active |
| US11994534B2 | Testing device for integrated circuit package | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.