Patent · US Active

Thin substrate handling via edge clamping

US11996315B2 · kind B2 · utility

1Cited by

18References

20Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Abhishek Chowdhury · Kanchinakote, IN
Harisha Sathyanarayana · Kanchinakote, IN
Edwin C. Suarez · Pleasanton, US
Siqing Lu · Sunnyvale, US
Nataraj Bhaskar Rao · Kanchinakote, IN

Key dates

Filing date	Nov 18, 2020
Grant date	May 28, 2024
Priority date	—
Expiry date	Dec 21, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/6875
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a cover ring for use in a process chamber includes: an annular body that includes an upper surface and a lower surface, an inner lip extending radially inward and downward from the annular body, and a plurality of protrusions extending downward from the inner lip and disposed at regular intervals along the inner lip, wherein lowermost surfaces of the plurality of protrusions together define a planar substrate contact surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.