Substrate processing apparatus and substrate processing method
US11998954B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2022 |
| Grant date | Jun 4, 2024 |
| Priority date | — |
| Expiry date | Aug 25, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus includes a liquid processing unit configured to supply, onto a front surface of a substrate, individual multiple processing liquids different from each other; an exhaust unit configured to exhaust an exhaust gas exhausted from the liquid processing unit to an outside. The exhaust unit includes a main exhaust pipe including a first portion and a second portion, a first individual exhaust pipe, a second individual exhaust pipe, a switching unit and an outside air introduction pipe. The switching unit includes a first switching mechanism, a second switching mechanism, a third switching mechanism provided between the first portion and the second portion of the main exhaust pipe, an outside air introduction pipe connected to the second portion to allow outside air to be introduced into the second portion, and a fourth switching mechanism provided in the outside air introduction pipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.