Lift pin assembly
US12002703B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 9, 2021 |
| Grant date | Jun 4, 2024 |
| Priority date | — |
| Expiry date | Sep 29, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67069
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatuses for substrate transfer are provided. A lift pin assembly can include a lift pin, a purge cylinder, and a lift pin guide. The lift pin guide is disposed adjacent the purge cylinder. The lift pin guide and the purge cylinder have a passage formed therethrough in which the lift pin is disposed. The purge cylinder includes one or more nozzles that direct the flow of gas radially inward into a portion of the passage disposed in the purge cylinder. The one or more nozzles are disposed radially outward from the lift pin. The purge cylinder reduces particle deposition on the substrate by preventing contact between the lift pin and the support assembly as the lift pin is in motion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.