Method and testing apparatus related to wafer testing
US12013431B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 22, 2021 |
| Grant date | Jun 18, 2024 |
| Priority date | — |
| Expiry date | Sep 16, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C29/56008
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and a testing apparatus related to wafer testing are provided. In the method, testing raw data is obtained by a testing apparatus operating with a Unix-related system. The testing raw data is a testing result of probe testing on one or more wafers by the testing apparatus. The testing raw data is converted into converted data by the testing apparatus. The converted data is related to the defect information of the wafer. Analyzed data is generated by the testing apparatus according to the converted data. The analyzed data is used for a graphical interface. Therefore, real-time defect analysis during the testing procedure may be provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.