Semiconductor package including non-conductive film and method for forming the same
US12015005B2 · kind B2 · utility
0Cited by
5References
20Claims
0Family size
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Key dates
| Filing date | Nov 30, 2021 |
| Grant date | Jun 18, 2024 |
| Priority date | — |
| Expiry date | Jun 3, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10156
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a semiconductor chip on a substrate. The semiconductor chip includes an active region, and a scribe lane in continuity with an edge of the active region. A non-conductive film (NCF) is between the substrate and the semiconductor chip, the non-conductive film (NCF) at least partially defines a recess region overlapping with the scribe lane in plan view and extending on the active region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.