Yeongbeom Ko
14Patents
1h-index
14Co-inventors
47Inventor score
Filing activity: Dec 9, 2010 → Sep 1, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8546957B2 | Integrated circuit packaging system with dielectric support and method of manufacture thereof | Electricity | 3 | Active |
| US11764161B2 | Ground connection for semiconductor device assembly | Electricity | 1 | Active |
| US11456289B2 | Face-to-face semiconductor device with fan-out porch | Electricity | 1 | Active |
| US12015005B2 | Semiconductor package including non-conductive film and method for forming the same | Electricity | 0 | Active |
| US8716108B2 | Integrated circuit packaging system with ultra-thin chip and method of manufacture thereof | Electricity | 0 | Active |
| US12300667B2 | Semiconductor package and method of fabricating the same | Electricity | 0 | Active |
| US12412824B2 | Semiconductor packages and methods of forming the same | Electricity | 0 | Active |
| US11942455B2 | Stacked semiconductor dies for semiconductor device assemblies | Electricity | 0 | Active |
| US11749665B2 | Face-to-face semiconductor device with fan-out porch | Electricity | 0 | Active |
| US8936969B2 | Semiconductor device and method of singulating semiconductor wafer along modified region within non-active region formed by irradiating energy through mounting tape | Electricity | 0 | Active |
| US11621245B2 | Microelectronic device packages with EMI shielding, methods of fabricating and related electronic systems | Electricity | 0 | Active |
| US11362071B2 | Stacked semiconductor dies for semiconductor device assemblies | Electricity | 0 | Active |
| US12051684B2 | Face-to-face semiconductor device with fan-out porch | Electricity | 0 | Active |
| US8709877B2 | Integrated circuit packaging system with an encapsulation and method of manufacture thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.