Heejae Nam
4Patents
1h-index
11Co-inventors
34Inventor score
Filing activity: Mar 29, 2021 → May 9, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11676914B2 | Semiconductor substrate and method of sawing the same | Electricity | 1 | Active |
| US12062626B2 | Semiconductor substrate and method of sawing the same | Electricity | 0 | Active |
| US12412824B2 | Semiconductor packages and methods of forming the same | Electricity | 0 | Active |
| US12015005B2 | Semiconductor package including non-conductive film and method for forming the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.