Cleaved semiconductor wafer imaging system
US12019031B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2021 |
| Grant date | Jun 25, 2024 |
| Priority date | — |
| Expiry date | Sep 25, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor wafer processing system for processing a semiconductor wafer includes a semiconductor wafer processing station for processing the semiconductor wafer and a semiconductor wafer imaging system that images the semiconductor wafer after the semiconductor wafer processing station processes the semiconductor wafer. The semiconductor wafer imaging system includes shroud panels defining a black box, a camera positioned in the black box for imaging the semiconductor wafer, and an illumination panel for directing diffuse light to the semiconductor wafer. A portion of the diffuse light is reflected off the semiconductor wafer and the camera images the semiconductor wafer by detecting the reflected diffuse light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.