Apparatus and method for processing wafer
US12020975B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 21, 2021 |
| Grant date | Jun 25, 2024 |
| Priority date | — |
| Expiry date | Jun 19, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This application relates to an apparatus and method for processing a wafer. In an embodiment of this application, an apparatus for processing a wafer includes: a heater including a pedestal, where a top portion of the pedestal includes an annular edge step and a wafer pocket recessed relative to the annular edge step to accommodate a wafer; a side ring, including an outer portion and a top portion, where the outer portion surrounds an outer side wall of the pedestal, and the top portion covers an outer portion of the annular edge step and includes a centripetal slant bevel; and a shadow ring, a bottom portion thereof including a slant bevel matching the centripetal slant bevel of the top portion of the side ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.