Substrate carrier head and processing system
US12023778B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2020 |
| Grant date | Jul 2, 2024 |
| Priority date | — |
| Expiry date | Jun 13, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/27
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A substrate carrier head is disclosed. In one aspect, the carrier head includes a carrier body, a substrate retainer, a first resilient membrane and a second resilient membrane. The carrier head can include an inner support plate. The substrate retainer is attached to the carrier body. The substrate retainer includes an aperture configured to receive a substrate. The first resilient membrane includes a first imperforated substrate support portion with a width W1. The second resilient membrane includes a second imperforated substrate support portion with a width W2. The second imperforated substrate support portion is positioned between the first substrate support portion and the carrier body, and is configured to selectively provide a force against at least an inner section of the first imperforated substrate support portion. The inner support plate is fixed relative to the carrier body and includes a support surface configured to support the second imperforated substrate support portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.