Maleimide resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor package
US12024624B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2021 |
| Grant date | Jul 2, 2024 |
| Priority date | — |
| Expiry date | Nov 16, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0366
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having one or more N-substituted maleimide groups and a derivative thereof; and (B) a polymer having a hydrocarbon chain or a polyether chain in a main chain thereof, wherein the component (A) contains (A1) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of less than 600 and (A2) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of 600 or more. The present invention also relates to a prepreg, a laminated board, a resin film, a printed wiring board, and a semiconductor package that are obtained by using the maleimide resin composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.