Patent · US Active

Measuring device and method for determining the course of a bonding wave

US12025426B2 · kind B2 · utility

1Cited by

15References

15Claims

0Family size

Assignee

EV GROUP E. THALLNER GMBH · AT

Inventors

Dominik Zinner · Ried im Innkreis, AT
Jurgen Mallinger · Ried im Innkreis, AT
Thomas Plach · Linz, AT
Boris Povazay · Wien, AT
Harald Rohringer · Oberleiten, AT
Jurgen Markus Suss · Rainbach, AT

Key dates

Filing date	Jan 18, 2019
Grant date	Jul 2, 2024
Priority date	—
Expiry date	Aug 26, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3511
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A measuring device for determining a course of a bonding wave in a gap between a first substrate and a second substrate, and a method for determining a course of a bonding wave in a gap between a first substrate and a second substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.