Thomas Plach
29Patents
4h-index
20Co-inventors
59Inventor score
Filing activity: Jan 25, 2011 → Feb 15, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10109487B2 | Method for bonding substrates | Electricity | 8 | Active |
| US8975158B2 | Method for permanently bonding wafers | Electricity | 6 | Active |
| US10279575B2 | Device and method for bonding substrates | Emerging Cross-Sectional Technologies | 6 | Active |
| US11282706B2 | Device and method for bonding of substrates | Electricity | 5 | Active |
| US9159717B2 | Method for permanently bonding wafers | Electricity | 3 | Active |
| US11315813B2 | Substrate holder and method for bonding two substrates | Electricity | 2 | Active |
| US10636662B2 | Device and method for bonding of substrates | Electricity | 2 | Active |
| US12025426B2 | Measuring device and method for determining the course of a bonding wave | Electricity | 1 | Active |
| US10504730B2 | Device and method for bonding of substates | Electricity | 1 | Active |
| US11059280B2 | Device and method for bonding substrates | Emerging Cross-Sectional Technologies | 1 | Active |
| US10748770B2 | Device and method for bonding of substrates | Electricity | 1 | Active |
| US11315901B2 | Method for bonding substrates | Electricity | 1 | Active |
| US10991609B2 | Method and substrate holder for the controlled bonding of substrates | Electricity | 1 | Active |
| US10861699B2 | Device and method for bonding of substrates | Electricity | 1 | Active |
| US11251045B2 | Device and method for bonding of substrates | Electricity | 1 | Active |
| US9252042B2 | Method for permanent bonding of wafers | Electricity | 1 | Active |
| US11527410B2 | Device and method for bonding of substrates | Electricity | 1 | Active |
| US12412865B2 | Apparatus and method for bonding substrates | Electricity | 0 | Active |
| US12199062B2 | Device and method for the alignment of substrates | Electricity | 0 | Active |
| US10825793B2 | Method for permanently bonding wafers | Electricity | 0 | Active |
| US11697281B2 | Device and method for bonding substrates | Emerging Cross-Sectional Technologies | 0 | Active |
| US11020953B2 | Device and method for bonding substrates | Emerging Cross-Sectional Technologies | 0 | Active |
| US11955339B2 | Device and method for bonding of substrates | Electricity | 0 | Active |
| US12131907B2 | Device and method for bonding of substrates | Electricity | 0 | Active |
| US11020951B2 | Device and method for bonding substrates | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.