Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
US12027380B2 · kind B2 · utility
0Cited by
9References
11Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 1, 2021 |
| Grant date | Jul 2, 2024 |
| Priority date | — |
| Expiry date | Oct 7, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6708
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one embodiment, a semiconductor manufacturing apparatus includes a substrate holder configured to hold a plurality of substrates such that the substrates are arranged in parallel to each other. The apparatus further includes a fluid injector including a plurality of openings that inject fluid to areas in which distances from surfaces of the substrates are within distances between centers of the substrates adjacent to each other, the fluid injector being configured to change injection directions of the fluid injected from the openings in planes that are parallel to the surfaces of the substrates by self-oscillation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.