Device including semiconductor chips and method for producing such device

US12027481B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Petteri Palm · Regensburg, DE
• Thorsten Scharf · Regensburg, DE

Key dates

• Filing date: Jan 30, 2023
• Grant date: Jul 2, 2024
• Expiry date: Feb 2, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/0152
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A device includes a first semiconductor chip including a first face, wherein a first contact pad is arranged over the first face. The device further includes a second semiconductor chip including a first face, wherein a first contact pad is arranged over the first face, wherein the first semiconductor chip and the second semiconductor chip are arranged such that the first face of the first semiconductor chip faces in a first direction and the first face of the second semiconductor chip faces in a second direction opposite to the first direction. The first semiconductor chip is located laterally outside of an outline of the second semiconductor chip.