Patent · US Active

Steam treatment stations for chemical mechanical polishing system

US12030093B2 · kind B2 · utility

0Cited by
57References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 16, 2022
Grant dateJul 9, 2024
Priority date
Expiry dateAug 16, 2042

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB08B2230/01
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

An apparatus for steam treatment of a conditioner head and/or conditioner disk in a chemical mechanical polishing system includes a conditioner cleaning cup, a boiler to generate steam, one or more nozzles positioned to direct steam inwardly into a cavity defined by the load cup, and a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.