Patent · US Active

Modular microwave source with multiple metal housings

US12033835B2 · kind B2 · utility

0Cited by

4References

12Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Philip Allan Kraus · San Jose, US
Robert B. Moore · Bigfork, US
James D. Carducci · Sunnyvale, US
Richard Fovell · San Jose, US
Sathya Swaroop Ganta · Sunnyvale, US
Karthikeyan Balaraman · Kanchinakote, IN
Silverst Rodrigues · Kanchinakote, IN

Key dates

Filing date	Jun 10, 2020
Grant date	Jul 9, 2024
Priority date	—
Expiry date	Jan 11, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01J37/32513
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

Embodiments disclosed herein include a modular microwave source array. In an embodiment, a housing assembly for the source array comprises a first conductive layer, wherein the first conductive layer comprises a first coefficient of thermal expansion (CTE), and a second conductive layer over the first conductive layer, wherein the second conductive layer comprises a second CTE that is different than the first CTE. In an embodiment, the housing assembly further comprises a plurality of openings through the housing assembly, where each opening passes through the first conductive layer and the second conductive layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.