Wireless in-situ real-time measurement of electrostatic chucking force in semiconductor wafer processing
US12033875B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 25, 2022 |
| Grant date | Jul 9, 2024 |
| Priority date | — |
| Expiry date | Jun 8, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6875
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments disclosed herein include an apparatus for measuring chucking force and methods of using such apparatuses. In an embodiment, the apparatus for measuring a chucking force comprises a substrate having a chucking surface, where the chucking surface is the surface that is supported by a chuck. In an embodiment, the apparatus further comprises a plurality of sensors over the chucking surface, where the plurality of sensors are thin film sensors with a thickness that is less than a thickness of the substrate. In an embodiment, the apparatus further comprises a wireless communication module electrically coupled to each of the plurality of sensors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.