Die package and method of manufacturing a die package

US12033909B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Petteri Palm · Regensburg, DE
• Angela Kessler · Regensburg, DE

Key dates

• Filing date: Jun 23, 2020
• Grant date: Jul 9, 2024
• Expiry date: Sep 29, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/35121
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A die package is provided. The die package may include a laminated carrier including at least one recess, a first die having a frontside, a backside, a frontside metallization on the frontside and a backside metallization on the backside, wherein the first die is arranged in the at least one recess, a first encapsulating material partially encapsulating the first die, by covering at least the frontside metallization or the backside metallization, and an adhesion promoter material between the metallization covered by the first encapsulation material and the first encapsulation material and in direct physical contact with the first encapsulation material and the metallization covered by the first encapsulation material.