Package structure, optical structure and method for manufacturing the same
US12033934B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 31, 2022 |
| Grant date | Jul 9, 2024 |
| Priority date | — |
| Expiry date | Aug 27, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure includes a first die, a second die, an encapsulant and at least one electrical contact. The first die has an active surface. The second die is disposed on the first die, and has an active surface and a backside surface opposite to the active surface. The active surface of the second die is closer to the active surface of the first die than the backside surface of the second die is. The encapsulant encapsulates the first die and the second die, and has a top surface far away from the active surface of the first die. The electrical contact is exposed from the top surface of the encapsulant and is configured for connecting at least one conductive wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.