Inventor

Yu-Ying Lee

24Patents
2h-index
15Co-inventors
50Inventor score

Filing activity: Aug 29, 2011 → Oct 11, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US10446411B2 Semiconductor device package with a conductive post Electricity 4 Active
US10049893B2 Semiconductor device with a conductive post Electricity 4 Active
US10741482B2 Semiconductor device package Electricity 2 Active
US10515884B2 Substrate having a conductive structure within photo-sensitive resin Electricity 1 Active
US9911702B2 Semiconductor package structure and fabrication method thereof Electricity 1 Active
US9984989B2 Semiconductor substrate and semiconductor package structure Electricity 1 Active
US11469165B2 Semiconductor device package Electricity 1 Active
US10224298B2 Semiconductor package device having glass transition temperature greater than binding layer temperature Electricity 1 Active
US12315785B2 Semiconductor device package Electricity 0 Active
US9054118B2 Heat dissipating semiconductor device packages and related methods Electricity 0 Active
US12033934B2 Package structure, optical structure and method for manufacturing the same Electricity 0 Active
US10103110B2 Semiconductor package structure and fabrication method thereof Electricity 0 Active
US11862550B2 Electronic package structure and method of manufacturing the same Electricity 0 Active
US10734337B2 Semiconductor package device having glass transition temperature greater than binding layer temperature Electricity 0 Active
US8592962B2 Semiconductor device packages with protective layer and related methods Electricity 0 Active
US10879159B2 Substrate, semiconductor package thereof and process of making same Electricity 0 Active
US11569179B2 Package structure including an outer lead portion and an inner lead portion and method for manufacturing package structure Electricity 0 Active
US10049976B2 Semiconductor substrate and manufacturing method thereof Electricity 0 Active
US11211536B2 Semiconductor device package and a method of manufacturing the same Electricity 0 Active
US8779581B2 Heat dissipating semiconductor device packages Electricity 0 Active
US10483196B2 Embedded trace substrate structure and semiconductor package structure including the same Electricity 0 Active
US10002843B2 Semiconductor substrate structure, semiconductor package and method of manufacturing the same Electricity 0 Active
US11784296B2 Semiconductor device package and a method of manufacturing the same Electricity 0 Active
US10665765B2 Semiconductor device package and a method of manufacturing the same Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.