Semiconductor device including a suspended reinforcing layer and method of manufacturing same
US12033958B2 · kind B2 · utility
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1References
18Claims
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Assignee
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Key dates
| Filing date | Nov 29, 2021 |
| Grant date | Jul 9, 2024 |
| Priority date | — |
| Expiry date | Apr 16, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a substrate, semiconductor dies on the substrate, molding compound and a reinforcing layer suspended within the molding compound. The reinforcing layer may for example be a copper foil formed in the molding compound over the semiconductor dies during the compression molding process. The reinforcing layer may have a structural rigidity which provides additional strength to the semiconductor device. The reinforcing layer may also be formed of a thermal conductor to draw heat away from a controller die within the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.